ICRPSTU
ICRPSTU BGA Reballing Stencil, Fast Tin Planting with Accurate Positioning, for Snapdragon 888, SM8350, xyn2100 CPU, + Ultra, G998U G996U Z Flip3 Z Fold3 W 22
327,62 kr.
546,03 kr.
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Order within 2 hours and 8 minutes to get between June 11 - June 17 -
Tracked Shipping on All Orders
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14-Day Returns
- Secure Payments
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24/7 Customer Support
Description
- [Applicable CPU] This CPU reballing stencil is applicable for Qualcomm Snapdragon 888, for SM8350, for xyn2100 CPU.
- [Suitable Model] This BGA reballing template is suitable for + Ultra series, for G998U G996U Z Flip3 Z Fold3 W 22, etc. phones.
- [Anti Sticking] With multiple IC slots on the body, which effectively prevent small IC from sticking tin and breaking corners.
- [Precise Positioning] Precisely made, the reballing template will accurately locate the CPU, with fast tin planting speed and high efficiency.
- [Stainless Steel Material] Made from stainless steel, the reballing stencil is high temperature , will not easily deform.
Shipping and Returns
- We offer tracked shipping on all orders. Tracking information will be shared as soon as the order is dispatched.
- Please check the delivery estimate before adding a product to the cart. This is displayed for every product on the website.
- Available shipping methods and charges will be displayed at the time of checkout, depending on your exact location.
- All customers are entitled to a return window of 14 days, starting from the date of delivery of the product(s).
- Customers are advised to read our return policy for details of the return process, eligibility, refunds as well as cancellations or exchanges.
- In case of any issues or concerns about Shipping or Returns, please contact us and we will be happy to help.
ICRPSTU.
ICRPSTU BGA Reballing Stencil, Fast Tin Planting with Acc...
327,62 kr.
546,03 kr.